PCB handling for SMT (SMD), THT

Handling of printed circuit boards in SMD assembly lines and application or test islands.

Communication technologies M2M realized by SMEMA(IPC-SMEMA-9851), Hermes(IPC-Hermes-9852) as well as vertical interfaces to MES (Manufacturing Execution System) e.g. IPC-CFX (Connected Factory Exchange).

SMT: surface-mounted technology – for SMD components

SMD: surface-mounted-device (surface-mounted components)

THT: through-hole technology (through-hole mounting, push-in mounting)

The application machines listed below are loaded and unloaded by the handling devices (board handling systems), which are one of ACHAT5 ‘s core competencies.

configurations are inline or as stand-alone systems with manual, semi-automated or fully automated feeding.

• Stencil Printer, Solder Paste Printer, Solder Paste Stencil Printer, Jet Printer (Jetter), Dispenser
• SPI (SolderPasteInspection), solder paste inspection
• P&P (pick and place), pick and place machines, chip shooters
• Chip bonder (adhesive dot SMD fixation) with subsequent drying
• FAI – First-Article-Inspection (first article inspection for NPI – New-Product-Introduction), which is also used for inspection after product changeover or as a spot sample check.
• CPI (Component Placement Inspection) serves as AOI before the soldering process(pre-reflow) for component and position control
• Soldering systems, reflow soldering systems (reflow soldering), vapor phase soldering, wave soldering, selective soldering (selective soldering systems with mini-wave, segment soldering, solder pen systems (soldering iron systems)
• AOI (Automated Optical Inspection), this automatic optical inspection after the soldering process(post-reflow) to assess solder joints VinCam
• AXI (Automated X-Ray Inspection), mostly used to assess hidden solder joints by means of X-ray inspection
• Review & Classification – After the automatic inspection (AOI or AXI) or with a manual inspection (MOI), the analysis takes place with classification of the detected “defects”, the deviations from specification patterns or measurement tolerances. With VinCam (Verification and Inspection Camera-System), an automated, digital microscope, the classification process is optimally supported. Of particular note here is the MultiRemote-capability, so that several lines can be operated from a remote location.
• ICT (In Circuit Test)
• FPT (Flying Probe Test) ~ ICT
• FT (functional test)
• Flash programming (block programming)
• Boundary Scan – test logical connections of components within a board using special components
• Robot cells with different tasks, possibly combined with the above-mentioned applications